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Cleaning power has significantly increased!
Successfully increased cleaning power significantly by combining a newly developed high-performance oscillator with a high-performance automatic tracking circuit!
This is an announcement from Japan Alex Corporation regarding the horn-type ultrasonic cleaning unit.
A new type of ultrasonic cleaning unit that can be used simply by screwing it into a 2.5-inch socket for cartridge heaters.
The cleaning time has been reduced from 2 hours to 30 minutes! It demonstrates overwhelming cleaning power at the same output and frequency!
We have achieved a cleaning power that is orders of magnitude greater than conventional types by combining it with a newly developed high-efficiency oscillator unit. Not only for cleaning, but the applications are limitless for deburring and degassing as well. We can also significantly reduce the cleaning time that previously took a long time and effectively clean workpieces that could not be thoroughly cleaned before. (If you have any applications or inquiries, please fill out the comment section below and contact us.)
Dual frequency high-speed switching method! Output and oscillation time for each frequency can be set, allowing for various conditions to be accommodated.
The "HRS-D" is a 40/100kHz dual-frequency ultrasonic cleaning unit capable of high-speed switching between two frequencies. It features a powerful 40kHz frequency used for degreasing purposes, and a 100kHz frequency that uniformly irradiates the workpiece with fine wavelengths, allowing for high-speed switching and selection of a single frequency. Output and oscillation time for each frequency can also be set to accommodate various conditions. 【Features】 ■ Capable of high-speed switching between two frequencies ・ Powerful 40kHz used for degreasing purposes ・ 100kHz that uniformly irradiates the workpiece with fine wavelengths ■ Selectable high-speed switching and single frequency ■ Output and oscillation time for each frequency can be set ■ Accommodates various conditions *For more details, please refer to the PDF document or feel free to contact us.
A cleaning unit that promotes chemical reactions from low power to high power.
In the field of chemistry, there is always a demand for improving the efficiency and accuracy of reactions. In particular, the cleaning of reaction vessels and substrates is crucial for the removal of impurities that can hinder reactions. If proper cleaning is not performed, it can lead to delays in reactions or incomplete combustion, ultimately negatively affecting the quality of the final product. Our cleaning unit, "Fine Jet," provides stable oscillation from low to high output, contributing to the efficiency of chemical reaction processes. [Usage Scenarios] - Cleaning of reaction vessels - Cleaning of substrates - Pre-cleaning before reagent preparation [Effects of Implementation] - Improved reaction efficiency - Stabilization of product quality - Reduction of cleaning time
From low power to high power, we meet the needs for deburring and cleaning in metal processing!
In the metal processing industry, the removal of burrs after machining is crucial for ensuring quality and safety. Especially in the case of precision parts and complex-shaped metal products, complete removal of burrs is required. If burrs remain, they can lead to product malfunctions and safety issues. The cleaning unit "Fine Jet" meets a wide range of needs for burr removal cleaning in metal processing through stable oscillation from low to high output. 【Usage Scenarios】 * Cleaning after burr removal of metal parts * Cleaning of precision machine parts * Cleaning of parts after cutting processing 【Benefits of Implementation】 * Improvement in product quality through reliable burr removal * Reduction and efficiency of cleaning time * Compatibility with various metal materials
A cleaning unit that achieves submicron level particle removal.
In the photomask industry, the removal of fine particles during the manufacturing process is a critical challenge that affects product quality and yield. In particular, the cleaning of wafers and photomasks requires the removal of submicron-level contaminants. Inadequate cleaning can lead to decreased device performance and the occurrence of defective products. Our cleaning unit, the "Proximity Megasonic PA10-Q60AE-S," enables cleaning close to the substrate and addresses these challenges by removing submicron particles. [Usage Scenarios] - Cleaning of silicon wafers - Cleaning of photomasks - Cleaning after CMP - Batch cleaning [Benefits of Implementation] - Improved yield due to high cleaning performance - Enhanced product quality - Reduced cleaning time
From low power to high power, we meet the precision cleaning needs of semiconductor manufacturing!
Precision cleaning in the semiconductor industry is a crucial process that affects product quality and yield. Particularly as miniaturization advances, fine foreign substances and residues adhering to wafers and substrates can lead to decreased device performance and defects. Therefore, high cleaning capability and minimizing damage to substrates are required. Fine jets contribute to solving challenges in semiconductor manufacturing by providing stable oscillation from low to high output, addressing various cleaning needs. 【Usage Scenarios】 - Wafer substrate cleaning - Magnetic disk cleaning - Post-CMP wafer cleaning 【Benefits of Implementation】 - Response to a wide range of cleaning needs - Improved yield through high-quality cleaning - Optimal cleaning through diverse nozzle variations
From low power to high power, we meet a wide range of needs for electronic device circuit board cleaning!
In the electronics industry, substrate cleaning is an important process for ensuring product quality and reliability. Especially in the case of miniaturized electronic components, thorough removal of foreign substances and residues is required. Inadequate cleaning can lead to decreased product performance or failure. Our cleaning unit, "Fine Jet," responds to a wide range of needs for electronic device substrate cleaning with stable oscillation from low to high output. 【Usage Scenarios】 - Cleaning of various wafer substrates - Cleaning of magnetic disks - Wafer cleaning after CMP 【Benefits of Implementation】 - Compatibility with diverse substrates - Improvement in product quality - Yield enhancement
From low power to high power, we meet a wide range of needs for glass surface treatment!
In the glass surface treatment industry, thorough cleaning of the substrate is essential to achieve high-quality surface treatment. In particular, if foreign substances or oil residues remain, it can significantly impair the quality of subsequent coatings or processing. Inconsistent cleaning or insufficient cleaning power can lead to product defects and reduced yield. FineJet allows for the selection of various frequencies, enabling the setting of optimal cleaning conditions for the characteristics of glass substrates and the surface treatment process. 【Usage Scenarios】 - Post-CMP cleaning of glass substrates - Cleaning of various glass substrates - Pre-treatment before surface processing 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased efficiency of the surface treatment process
